How 3D-Printing Is Changing RF Front-End Design for Space Applications

Integrated Active Antenna Approach for Rf Front-end Design

Kevin M. K. H. Leong Department of Electrical Engineering, University of California, Los Angeles, 405 Hilgard Avenue, Los Angeles, CA 90095, USA Ji-Yong Park Department of Electrical Engineering, University of California, Los Angeles, 405 Hilgard Avenue, Los Angeles, CA 90095, USA Tatsuo Itoh Department of Electrical Engineering, University of California, Los Angeles, 405 Hilgard Avenue, Los An...

RF front-end CMOS design for build-in-self-test

Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications

This paper demonstrates, for the first time, an integrated radio frequency (RF) front-end module (FEM) with precision matching circuits in ultra-miniaturized glass substrates for LTE applications. Through full-wave electromagnetic (EM) simulations, electrical performance of these glass-based long term evolution (LTE) packages is compared with traditional RF modules with surface mount devices (S...

Simplifying RF front-end design in multiband handsets

R uthless competition in the handset market continues to drive manufacturers to search for new opportunities to drive down cost, printed circuit board (PCB) area and power consumption. Simultaneously, the rollout of third-generation (3G) networks has opened the door to a variety of new multimedia and data-based applications, from wireless Internet access and mobile video to text messaging and m...

Rf Front-end Design with Copper Passive Components

In this paper we evaluate the impact of copper passive components on RF circuit performance. A fully-differential RF Front-end is used as a test vehicle to compare the UMC 0.18 micron copper process with a traditional 0.25 micron aluminium process. The RF Front-end contains a balun and a low noise amplifier (LNA) that are designed with spiral inductors and capacitors. Spiral inductor Q values r...